A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Company's two-dimensional data matrix barcode labels will be powered by GS1 standards to support traceability, interoperability, and streamline workflows for hospitals and health systems "QuVa ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback